JPH0258845A - 超音波ワイヤボンディング装置 - Google Patents

超音波ワイヤボンディング装置

Info

Publication number
JPH0258845A
JPH0258845A JP63211423A JP21142388A JPH0258845A JP H0258845 A JPH0258845 A JP H0258845A JP 63211423 A JP63211423 A JP 63211423A JP 21142388 A JP21142388 A JP 21142388A JP H0258845 A JPH0258845 A JP H0258845A
Authority
JP
Japan
Prior art keywords
bonding
ultrasonic
ultrasonic wave
wire
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63211423A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0550136B2 (en]
Inventor
Yasuhiko Shimizu
清水　靖彦
Hiroaki Kobayashi
弘明 小林
Osamu Matsumoto
修 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP63211423A priority Critical patent/JPH0258845A/ja
Priority to US07/398,438 priority patent/US4958762A/en
Publication of JPH0258845A publication Critical patent/JPH0258845A/ja
Publication of JPH0550136B2 publication Critical patent/JPH0550136B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
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    • H01L2924/20303—Ultrasonic frequency [f] 50 Khz=<f< 75 KHz

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP63211423A 1988-08-25 1988-08-25 超音波ワイヤボンディング装置 Granted JPH0258845A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63211423A JPH0258845A (ja) 1988-08-25 1988-08-25 超音波ワイヤボンディング装置
US07/398,438 US4958762A (en) 1988-08-25 1989-08-25 Ultrasonic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63211423A JPH0258845A (ja) 1988-08-25 1988-08-25 超音波ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH0258845A true JPH0258845A (ja) 1990-02-28
JPH0550136B2 JPH0550136B2 (en]) 1993-07-28

Family

ID=16605711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63211423A Granted JPH0258845A (ja) 1988-08-25 1988-08-25 超音波ワイヤボンディング装置

Country Status (2)

Country Link
US (1) US4958762A (en])
JP (1) JPH0258845A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223063A (en) * 1989-04-17 1993-06-29 Kabushiki Kaisha Shinkawa Method for bonding semiconductor elements to a tab tape
WO2010150350A1 (ja) * 2009-06-23 2010-12-29 東芝三菱電機産業システム株式会社 超音波接合用ツール、超音波接合用ツールの製造方法、超音波接合方法及び超音波接合装置

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0713988B2 (ja) * 1990-02-13 1995-02-15 株式会社東芝 ワイヤボンディング方法
US5207369A (en) * 1990-11-29 1993-05-04 Matsushita Electric Industrial Co., Ltd. Inner lead bonding apparatus
KR940002771Y1 (ko) * 1991-05-14 1994-04-23 금성일렉트론 주식회사 리드 프레임의 인너리드 클램프장치
JPH08153759A (ja) * 1994-11-29 1996-06-11 Nec Yamagata Ltd シングルポイントボンダーおよび半導体装置の製造方法
US5890644A (en) 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US5673845A (en) * 1996-06-17 1997-10-07 Micron Technology, Inc. Lead penetrating clamping system
US5944249A (en) * 1996-12-12 1999-08-31 Texas Instruments Incorporated Wire bonding capillary with bracing component
JP4128513B2 (ja) * 2003-10-07 2008-07-30 株式会社新川 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム
US7322507B2 (en) * 2005-01-17 2008-01-29 Amkor Technology, Inc. Transducer assembly, capillary and wire bonding method using the same
RU2511669C1 (ru) * 2012-11-02 2014-04-10 Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук Электрические контакты для сверхпроводникового интегрального приемника
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
CN110253132B (zh) * 2019-07-05 2021-03-26 惠州市杰优实业有限公司 一种动力电池极耳焊接装置及方法
CN118539109B (zh) * 2024-07-25 2024-10-29 比亚迪股份有限公司 一种动力电池的引线键合方法、动力电池及用电设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050933A (ja) * 1983-08-30 1985-03-22 Toshiba Corp ワイヤボンディング装置
JPS61131464A (ja) * 1984-11-29 1986-06-19 Nec Kansai Ltd ワイヤボンデイング方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61174732A (ja) * 1985-01-30 1986-08-06 Nec Kansai Ltd ワイヤボンデイング装置
JPS6342855A (ja) * 1986-08-11 1988-02-24 豊田合成株式会社 モ−ル

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050933A (ja) * 1983-08-30 1985-03-22 Toshiba Corp ワイヤボンディング装置
JPS61131464A (ja) * 1984-11-29 1986-06-19 Nec Kansai Ltd ワイヤボンデイング方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223063A (en) * 1989-04-17 1993-06-29 Kabushiki Kaisha Shinkawa Method for bonding semiconductor elements to a tab tape
WO2010150350A1 (ja) * 2009-06-23 2010-12-29 東芝三菱電機産業システム株式会社 超音波接合用ツール、超音波接合用ツールの製造方法、超音波接合方法及び超音波接合装置
JP5303643B2 (ja) * 2009-06-23 2013-10-02 東芝三菱電機産業システム株式会社 超音波接合用ツール、超音波接合用ツールの製造方法、超音波接合方法及び超音波接合装置
US10864597B2 (en) 2009-06-23 2020-12-15 Toshiba Mitsubishi-Electric Industrial Systems Corporation Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus

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JPH0550136B2 (en]) 1993-07-28
US4958762A (en) 1990-09-25

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